Cleanroom

Class 100 and 1000 Cleanrooms are shared facilities within CRANN.

Class 100 Cleanroom

This room is used primarily for UV Lithography. Its facilities include:

• Spin resist
• UV Mask Aligner
• Laser Mask Writer (Heidelberg DWL66)
• Solvent wet bench
• Dry Plasma Etcher (OIPT Plasmalab System100 ICP180)
• Acid wet bench

Class 1,000 Cleanroom

This room contains a variety of deposition systems

• Temescal Evaporation System
  This is a flexible tool, commonly used in conjunction with UV and E-beam Lithography. Its features include:
  • 6-pocket electron beam evaporation source, a thermal evaporation source
  • ion source
  • substrate infrared heater and liquid nitrogen cooler
  • process gas controller
  • fast-cycle load lock
• LPCVD Evaporation System
• Automated wafer dicing system (Disco DAD 3220 wafer dicer)

For more information on these and more devices, see the cleanroom page on the CRANN website.